Recently, Texas Instruments (TI) announced that its second 300mm semiconductor wafer fab in Lehi, Utah, has broken ground. Upon completion, TI's two factories in Utah will produce tens of millions of analog and embedded processing chips at full capacity daily.

Haviv Ilan, President and CEO of Texas Instruments, stated, "Today, we take a significant step towards expanding the company's manufacturing footprint. This new wafer fab is part of our long-term plan for 12-inch wafer capacity to meet the needs of our customers for decades to come. At Texas Instruments, we are committed to making electronic products more affordable through semiconductor technology, making the world a better place. We are extremely proud that the analog and embedded processing semiconductors we manufacture are critical for almost all types of electronic systems today."

TI Announces the Official Groundbreaking of Its Second 12-Inch Wafer Fab in Utah

In February of this year, Texas Instruments announced a $11 billion investment in Utah, the largest economic investment in the state's history. LFAB2 will create approximately 800 additional jobs for TI and thousands of indirect jobs, with the earliest production expected to begin in 2026.

Texas Instruments' newly constructed LFAB2 will complement its existing 300mm wafer fabs, including LFAB1 in Lehi, Utah, DMOS6 in Dallas, and RFAB1 and RFAB2, all located in Richardson, Texas. Additionally, Texas Instruments is building four new 300mm wafer fabs (SM1, SM2, SM3, and SM4) in Sherman, Texas, with the first fab expected to be operational in 2025.

The fab is located adjacent to Texas Instruments' existing 12-inch wafer fab in Lehi. Upon completion, Texas Instruments' two fabs in Utah, operating at full capacity, will produce tens of millions of analog and embedded processing chips every day.