Japanese semiconductor equipment giant DISCO has developed a groundbreaking SiC (Silicon Carbide) wafer cutting equipment, DFG8541, capable of processing up to 8-inch silicon and silicon carbide wafers. This new machine elevates SiC wafer cutting speeds to ten times their previous rate. Silicon Carbide, known for its high power efficiency as a semiconductor material, has been challenging to process due to its hardness. DISCO's innovation is set to establish a new era in mass production technology for power semiconductors, potentially accelerating the proliferation of electric vehicles.

The unique properties of Silicon Carbide, such as reducing electrical losses, have led to its rapidly expanding demand in sectors like electric vehicles and power stations. SiC's hardness is 1.8 times that of mainstream silicon, making it the third hardest substance known, next to diamond and boron carbide.

DISCO's new equipment utilizes a laser scribing method followed by mechanical breaking to achieve cutting, significantly faster than traditional grinding wheel methods. Each unit, priced in the tens of millions of yen, is expected to see an expanded sales reach to global semiconductor manufacturers.

The cost of SiC wafers is considerably higher than silicon, but with easier processing and increased production efficiency, a decrease in semiconductor material and energy-saving semiconductor prices is possible. Japanese domestic equipment and material manufacturers are ramping up mass production technology for Silicon Carbide. KOKUSAI ELECTRIC is also set to release a new high-temperature wafer surface coating equipment in 2025.

With DISCO mainly involved in the "backend" equipment corresponding to the final product in the semiconductor manufacturing process, its market share in wafer dicing and grinding machines is between 70% and 80%. Additionally, power semiconductor manufacturing equipment, which currently accounts for about 25% of DISCO's revenue, is witnessing strong demand.

This development by DISCO signifies a major leap in semiconductor technology, with potential impacts across various industries relying on efficient and advanced semiconductor components.