Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-93-652-61-008000

116-93-652-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

8489 28.11
- +

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116-93-652-61-008000 Tube * Active - - - - - - - - - - - - - -
110-13-964-61-001000

110-13-964-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

7316 28.16
- +

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110-13-964-61-001000 Tube * Active - - - - - - - - - - - - - -
32-6570-11

32-6570-11

CONN IC DIP SOCKET ZIF 32POS GLD

Aries Electronics

8398 28.20
- +

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32-6570-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-3503-31

36-3503-31

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

7331 28.85
- +

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36-3503-31

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
550-10-360M19-001166

550-10-360M19-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip

6749 27.73
- +

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550-10-360M19-001166

Datasheet

Bulk 550 Active BGA 360 (19 x 19) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
550-10-352M26-001166

550-10-352M26-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip

7039 27.93
- +

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550-10-352M26-001166

Datasheet

Bulk 550 Active BGA 352 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
510-93-108-12-051002

510-93-108-12-051002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

8235 29.11
- +

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510-93-108-12-051002

Datasheet

Bulk 510 Active PGA 108 (12 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
36-6551-11

36-6551-11

CONN IC DIP SOCKET ZIF 36POS GLD

Aries Electronics

7347 26.25
- +

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36-6551-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-6552-11

36-6552-11

CONN IC DIP SOCKET ZIF 36POS GLD

Aries Electronics

7318 26.25
- +

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36-6552-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-6553-11

36-6553-11

CONN IC DIP SOCKET ZIF 36POS

Aries Electronics

7835 26.25
- +

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36-6553-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-3552-11

36-3552-11

CONN IC DIP SOCKET ZIF 36POS GLD

Aries Electronics

8511 26.25
- +

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Inquiry Now

36-3552-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-3554-11

36-3554-11

CONN IC DIP SOCKET ZIF 36POS GLD

Aries Electronics

8337 26.25
- +

Add To Cart

Inquiry Now

36-3554-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-6554-11

36-6554-11

CONN IC DIP SOCKET ZIF 36POS GLD

Aries Electronics

7440 26.25
- +

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Inquiry Now

36-6554-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
116-43-652-61-006000

116-43-652-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

7476 26.29
- +

Add To Cart

Inquiry Now

116-43-652-61-006000 Tube * Active - - - - - - - - - - - - - -
116-93-652-61-006000

116-93-652-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

8350 26.29
- +

Add To Cart

Inquiry Now

116-93-652-61-006000 Tube * Active - - - - - - - - - - - - - -
517-83-411-20-111111

517-83-411-20-111111

CONN SOCKET PGA 411POS GOLD

Preci-Dip

8607 24.59
- +

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Inquiry Now

517-83-411-20-111111

Datasheet

Bulk 517 Active PGA 411 (20 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
32-6556-21

32-6556-21

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

7275 26.35
- +

Add To Cart

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32-6556-21

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
32-6556-31

32-6556-31

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

7842 26.35
- +

Add To Cart

Inquiry Now

32-6556-31

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
123-13-952-41-001000

123-13-952-41-001000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

8674 26.38
- +

Add To Cart

Inquiry Now

123-13-952-41-001000

Datasheet

Tube 123 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
36-0508-21

36-0508-21

CONN SOCKET SIP 36POS GOLD

Aries Electronics

7131 26.40
- +

Add To Cart

Inquiry Now

36-0508-21

Datasheet

Bulk 508 Active SIP 36 (1 x 36) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
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