Mfr. Part # | Stock | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial | |
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116-93-652-61-008000CONN IC SKT DBL |
8489 | 28.11 |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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110-13-964-61-001000CONN IC SKT DBL |
7316 | 28.16 |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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32-6570-11CONN IC DIP SOCKET ZIF 32POS GLD |
8398 | 28.20 |
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![]() Datasheet |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
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36-3503-31CONN IC DIP SOCKET 36POS GOLD |
7331 | 28.85 |
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![]() Datasheet |
Bulk | 503 | Active | DIP, 0.3 (7.62mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
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550-10-360M19-001166BGA PIN ADAPTER 1.27MM SMD |
6749 | 27.73 |
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Bulk | 550 | Active | BGA | 360 (19 x 19) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
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550-10-352M26-001166BGA PIN ADAPTER 1.27MM SMD |
7039 | 27.93 |
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Bulk | 550 | Active | BGA | 352 (26 x 26) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
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510-93-108-12-051002SKT PGA SOLDRTL |
8235 | 29.11 |
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Bulk | 510 | Active | PGA | 108 (12 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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36-6551-11CONN IC DIP SOCKET ZIF 36POS GLD |
7347 | 26.25 |
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![]() Datasheet |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
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36-6552-11CONN IC DIP SOCKET ZIF 36POS GLD |
7318 | 26.25 |
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![]() Datasheet |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
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36-6553-11CONN IC DIP SOCKET ZIF 36POS |
7835 | 26.25 |
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![]() Datasheet |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
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36-3552-11CONN IC DIP SOCKET ZIF 36POS GLD |
8511 | 26.25 |
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![]() Datasheet |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
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36-3554-11CONN IC DIP SOCKET ZIF 36POS GLD |
8337 | 26.25 |
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![]() Datasheet |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
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36-6554-11CONN IC DIP SOCKET ZIF 36POS GLD |
7440 | 26.25 |
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![]() Datasheet |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
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116-43-652-61-006000CONN IC SKT DBL |
7476 | 26.29 |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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116-93-652-61-006000CONN IC SKT DBL |
8350 | 26.29 |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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517-83-411-20-111111CONN SOCKET PGA 411POS GOLD |
8607 | 24.59 |
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![]() Datasheet |
Bulk | 517 | Active | PGA | 411 (20 x 20) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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32-6556-21CONN IC DIP SOCKET 32POS GOLD |
7275 | 26.35 |
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![]() Datasheet |
Bulk | 6556 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
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32-6556-31CONN IC DIP SOCKET 32POS GOLD |
7842 | 26.35 |
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![]() Datasheet |
Bulk | 6556 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
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123-13-952-41-001000CONN IC DIP SOCKET 52POS GOLD |
8674 | 26.38 |
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![]() Datasheet |
Tube | 123 | Active | DIP, 0.9 (22.86mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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36-0508-21CONN SOCKET SIP 36POS GOLD |
7131 | 26.40 |
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![]() Datasheet |
Bulk | 508 | Active | SIP | 36 (1 x 36) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 |
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